Third IEEE International Workshop on
Testing Three-Dimensional Stacked Integrated Circuits
3D-Test
in conjunction with ITC / Test Week 2012
November 8-9, 2012 - Disneyland Hotel Anaheim, California, USA
Submission

Submissions must be sent in as PDF file via the Welcome paper submission system: http://welcome.molesystems.com/tttc/3DTEST/2012

Key Dates

  • Submission deadline: September 16, 2012 (extended!)
  • Notification of acceptance : September 25, 2012
  • Camera-ready material : October 22, 2012
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